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Multi-chip memory device with stacked memory chips, method of stacking memory chips, and method of controlling operation of multi-chip package memory
Multi-chip memory device with stacked memory chips, method of stacking memory chips, and method of controlling operation of multi-chip package memory
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机译:具有堆叠存储芯片的多芯片存储装置,堆叠存储芯片的方法以及控制多芯片封装存储器的操作的方法
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摘要
A multi-chip memory device includes a transfer memory chip communicating input/output signals, a stacked plurality of memory chips each including a memory array having a designated bank, and a signal path extending upward from the transfer memory chip through the stack of memory chips to communicate input/output signals, wherein each bank of each memory chip in the stacked plurality of memory chips is commonly addressed to provide read data during a read operation and receive write data during a write operation, and vertically aligned within the stacked plurality of memory chips.
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