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BiCMOS devices with a self-aligned emitter and methods of fabricating such BiCMOS devices

机译:具有自对准发射极的BiCMOS器件及其制造方法

摘要

A method of fabricating an heterojunction bipolar transistor (HBT) structure in a bipolar complementary metal-oxide-semiconductor (BiCMOS) process selectively thickens an oxide layer overlying a base region in areas that are not covered by a temporary emitter and spacers such that the temporary emitter can be removed and the base-emitter junction can be exposed without also completely removing the oxide overlying the areas of the base region that are not covered by the temporary emitter or spacers. As a result, a photomask is not required to remove the temporary emitter and to expose the base-emitter junction.
机译:一种在双极互补金属氧化物半导体(BiCMOS)工艺中制造异质结双极晶体管(HBT)结构的方法,选择性地加厚覆盖在未被临时发射极和间隔物覆盖的区域中的基极区域上的氧化物层,从而使临时性可以去除发射极,并且可以暴露基极-发射极结,而无需完全去除覆盖在未被临时发射极或隔离层覆盖的基极区域上的氧化物。结果,不需要光掩模来去除临时发射极并暴露基极-发射极结。

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