首页> 外国专利> METHODS FOR MANUFACTURING COMPOUND SEMICONDUCTOR AND COMPOUND INSULATOR USING CHEMICAL REACTION AND DIFFUSION BY HEATING, COMPOUND SEMICONDUCTOR AND COMPOUND INSULATOR MANUFACTURED USING THE METHOD, AND PHOTOCELL, ELECTRONIC CIRCUIT, TRANSISTOR, AND MEMORY USING THE SAME

METHODS FOR MANUFACTURING COMPOUND SEMICONDUCTOR AND COMPOUND INSULATOR USING CHEMICAL REACTION AND DIFFUSION BY HEATING, COMPOUND SEMICONDUCTOR AND COMPOUND INSULATOR MANUFACTURED USING THE METHOD, AND PHOTOCELL, ELECTRONIC CIRCUIT, TRANSISTOR, AND MEMORY USING THE SAME

机译:通过化学反应和扩散制造复合半导体和复合绝缘子的方法,使用该方法制造的复合半导体和复合绝缘子,以及使用光电池,电子电路,晶体管和存储器的方法

摘要

Provided are methods for manufacturing a compound semiconductor and a compound insulator using chemical reaction and diffusion induced by heating, a compound semiconductor and a compound insulator formed using the methods, and a photocell, an electronic circuit, a transistor, and a memory including the compound semiconductor or the compound insulator. The method for manufacturing a compound semiconductor or a compound insulator involves forming a stacked structure including a rare earth transition metal intermediate layer, which is highly reactive to oxygen and/or sulfur, interposed between dielectric layers containing oxygen and/or sulfur and heating the stacked structure to induce chemical reaction and diffusion between the dielectric layers and the intermediate layer, wherein the heating is performed at different temperatures for the compound semiconductor and the compound insulator.
机译:提供了通过加热引起的化学反应和扩散来制造化合物半导体和化合物绝缘体的方法,使用该方法形成的化合物半导体和化合物绝缘体,以及包括该化合物的光电池,电子电路,晶体管和存储器。半导体或复合绝缘子。用于制造化合物半导体或化合物绝缘体的方法包括形成包括对氧和/或硫具有高反应性的稀土过渡金属中间层的叠层结构,该叠层结构插入包含氧和/或硫的介电层之间并加热该叠层。介电层和中间层之间的化学反应和扩散的结构,其中对于化合物半导体和化合物绝缘体在不同温度下进行加热。

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