MOISTURE CURE ADHESIVE FOR BONDING STRUCTURAL WOOD

摘要

The invention is directed to a moisture cure adhesive composition for bonding structural wood substrates. The composition includes a moisture curable isocyanate terminated polyurethane prepolymer that is a reaction product of an aliphatic polyol component, an aromatic polyol component, and an aromatic isocyanate component. The composition exhibits an extremely high heat resistance at 180 °C.