EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION, HARDENED MATERIAL THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE

摘要

Disclosed is an epoxy resin hardening agent that contains a multivalent carboxylic acid anhydride and a dendritic polymer with a hydroxy value of 550 mg KOH/g or less, with the aforementioned dendritic molecule preferably having a weight-average molecular weight of 2000 or less. Thus, an epoxy resin composition with low viscosity and good handling can be obtained, and a hardened material with little discoloration, excellent crack resistance, and excellent transparency can be obtained.