EPOXY RESIN CURING AGENT EPOXY RESIN COMPOSITION HARDENED MATERIAL THEREOF AND OPTICAL SEMICONDUCTOR DEVICE

摘要

The present invention relates to an epoxy resin curing agent comprising a dendritic polymeric anhydride and a dendritic polymer having a hydroxyl value of 550 mgKOH / g or less, preferably the dendritic polymer having a weight average molecular weight of 2000 or less, An epoxy resin composition having good properties can be obtained, and a cured product excellent in crack resistance and transparency can be obtained with less coloring.