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Multi-axis force sensor chip and multi-axis force sensor using same

机译:多轴力传感器芯片和使用该芯片的多轴力传感器

摘要

A multi-axis sensor chip (1) provided by the invention includes a semiconductor substrate (2) having an action part (4) having an external force action area part (4A) and non-deforming area parts (4B), a support part (3) supporting the action part, and connecting parts (5A, 5B, 5C, 5D) connecting the action part to the support part. The sensor chip also has strain resistance devices Sxa1 to Sxa3, Sya1 to Sya3, Sxb1 to Sxb3, Syb1 to Syb3 provided on deforming parts of the connecting parts and has temperature-compensating resistance devices (11) provided on the non-deforming area parts. Temperature compensation is carried out exactly by means of the temperature-compensating resistance devices when an external force or a load acts on the action part, and highly accurate stress detection can be carried out.
机译:本发明提供的多轴传感器芯片(1)包括:半导体基板(2),其具有作用部分(4),该作用部分具有外力作用区域部分(4A)和非变形区域部分(4B);支撑部分(3)支撑动作部分,以及将动作部分连接到支撑部分的连接部分(5A,5B,5C,5D)。传感器芯片还具有设置在连接部分的变形部分上的应变电阻装置Sxa1至Sxa3,Sya1至Sya3,Sxb1至Sxb3,Syb1至Syb3,并且在非变形区域部分上具有温度补偿电阻装置(11)。当外力或负载作用在作用部位上时,借助于温度补偿电阻装置精确地进行温度补偿,并且可以进行高精度的应力检测。

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