首页>
外国专利>
WAVELENGTH SELECTING METHOD, FILM THICKNESS MEASURING METHOD, FILM THICKNESS MEASURING APPARATUS, AND THIN FILM SILICON DEVICE MANUFACTURING SYSTEM
WAVELENGTH SELECTING METHOD, FILM THICKNESS MEASURING METHOD, FILM THICKNESS MEASURING APPARATUS, AND THIN FILM SILICON DEVICE MANUFACTURING SYSTEM
展开▼
机译:波长选择方法,膜厚测量方法,膜厚测量设备以及膜硅器件制造系统
展开▼
页面导航
摘要
著录项
相似文献
摘要
An object is to reduce film thickness measurement error. Illumination light having different wavelengths is radiated onto a plurality of samples in which thin films having different film qualities and film thicknesses are provided on substrates, evaluation values related to the amounts of transmitted light when the illumination light of each wavelength is radiated are measured, film thickness characteristics, showing the relationship between the evaluation values and the film thicknesses for each film quality, are formed at each wavelength based on the measurement results, and among the film thickness characteristics, a wavelength at which a measurement difference between the evaluation values caused by the film qualities is in a predetermined range is selected.
展开▼