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TWO-DIMENSIONAL MEASURING INSTRUMENT AND TWO-DIMENSIONAL MEASURING METHOD

机译:二维测量仪器和二维测量方法

摘要

Provided is a two-dimensional measuring method which includes: a step (S21) of measuring the coordinate values of a reference point obtained from a reference pattern provided on a substrate by means of two image pickup systems, which are provided on an image pickup section and have magnifying powers different from each other, using a two-dimensional measuring tool which measures the coordinate positions of one area on the surface of the substrate by means of one image pickup system selected each time out of the two image pickup systems; a step (S22) of calculating the deviation quantity between the measurement values obtained by the two image pickup systems in the measuring step; and a step (S23) of setting the deviation quantity as a correction parameter. Each time before or after performing the measuring operation to the substrates of a fixed quantity, the step (S21), the step (S22) and the step (S23) are performed.
机译:提供一种二维测量方法,其包括:步骤(S21),其通过设置在图像拾取部上的两个图像拾取系统来测量从设置在基板上的参考图案获得的参考点的坐标值。使用具有通过在两个摄像系统中每次选择的一个摄像系统来测量基板表面上的一个区域的坐标位置的二维测量工具,来具有彼此不同的放大率;步骤(S22),计算在测量步骤中由两个图像拾取系统获得的测量值之间的偏差量;将偏差量设定为校正参数的步骤(S23)。每次对固定量的基板进行测量操作之前或之后,都执行步骤(S21),步骤(S22)和步骤(S23)。

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