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Method and apparatus for accurately applying structures to a substrate

机译:用于将结构精确地施加到基板上的方法和设备

摘要

A method wherein a substrate is provided, wherein, in a scanning step, structures already applied to the substrate are detected by at least one scanning provision of a processing head, wherein the processing head is provided with at least one lighting provision, which lighting provision locally lights the applied lacquer structure in a lighting step by using the information obtained with the scanning step. Further, an apparatus for carrying out the method is described, which apparatus is provided with a processing head which is which is movable relative to a substrate carrier, wherein the processing head comprises at least one scanning provision and at least one lighting provision.
机译:一种提供衬底的方法,其中,在扫描步骤中,通过处理头的至少一个扫描提供来检测已经施加到衬底上的结构,其中处理头具有至少一个照明提供,该照明提供通过使用在扫描步骤中获得的信息,在照明步骤中局部地对所施加的漆结构进行照明。此外,描述了用于执行该方法的设备,该设备设置有相对于基板载体可移动的处理头,其中该处理头包括至少一个扫描装置和至少一个照明装置。

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