首页> 外国专利> THERMOSET MONOMER CROSS-LINKING AGENT, A COMPOSITION FOR FORMING A PRINTED CIRCUIT BOARD AND THE PRINTED CIRCUIT BOARD USING THE SAME WITH EXCELLENT MECHANICAL PROPERTY

THERMOSET MONOMER CROSS-LINKING AGENT, A COMPOSITION FOR FORMING A PRINTED CIRCUIT BOARD AND THE PRINTED CIRCUIT BOARD USING THE SAME WITH EXCELLENT MECHANICAL PROPERTY

机译:热塑性单体交联剂,用于形成印刷电路板的组合物和使用具有优异机械性能的印刷电路板的组合物

摘要

PURPOSE: A thermoset monomer cross-linking agent is provided to ensure excellent solubility to solvent by comprising an amide functional group and to be curable at a low temperature.;CONSTITUTION: A thermoset monomer cross-linking agent with a structure of chemical formula 1 has acetylene groups introduced at both ends of a main chain. In formula, Ar1 and Ar2 are divalent aromatic organic group and comprise at least one structure unit selected from the group consisting of chemical formula 2. A composition for Printed circuit board comprises the thermoset monomer cross-linking agent of chemical formula 1 and a soluble liquid-crystal polymer or liquid crystal thermostat oligomer.;COPYRIGHT KIPO 2010
机译:目的:提供一种热固性单体交联剂,通过包含酰胺官能团确保在溶剂中的优异溶解性,并在低温下可固化。;组成:化学式1结构的热固性单体交联剂具有在主链两端引入的乙炔基。式中,Ar 1和Ar 2为二价的芳香族有机基团,并包含选自化学式2中的至少一个结构单元。印刷电路板用组合物包含化学式1的热固性单体交联剂和可溶性液体。晶体聚合物或液晶恒温低聚物。; COPYRIGHT KIPO 2010

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号