SEMICONDUCTOR PACKAGE, CAPABLE OF SELECTING A PLURALITY OF STACKED SEMICONDUCTOR CHIPS USING ONE CHIP SELECTION PAD

摘要

PURPOSE: A semiconductor package is provided to improve data process speed or data storage capacity of a semiconductor chip by selecting one semiconductor chip among a plurality of stacked semiconductor chips using one chip selection electrode or one chip selection pad.;CONSTITUTION: If the level of a signal applied from the outside is a preset level, an operation signal provider(110) outputs a chip selection signal. A semiconductor chip(120) is operated by a chip selection signal. The semiconductor chip is electrically connected to a bonding pad into which the chip selection signal is inputted. The semiconductor chip includes a penetration electrode passing through the semiconductor chip.;COPYRIGHT KIPO 2010