MEMS BUMP PATTERN DIE ALIGNMENT SYSTEM AND METHOD TO ATTACH BUMP PATTERNS OR MEMS DIES TO AN ALIGNMENT PLATE BASED ON THE REFERENCE POINTS

摘要

PURPOSE: A MEMS bump pattern die alignment system and method are provided to improve the performance of a MEMS sensor by aligning MEMS dies on an alignment plate based on the reference points.;CONSTITUTION: A MEMS device includes an LLC(Leadless Chip Carrier) housing(40), an alignment plate(68), a plurality of bumps(70), and MEMS dies(74). The alignment plate is attached to an inner base part(60) of the LLC housing. The bumps are attached to a first side of the alignment plate and the MEMS dies are attached to the bumps.;COPYRIGHT KIPO 2010