首页> 外国专利> COMPOSITION FOR SPUTTERING TARGET OF OXIDE SEMICONDUCTOR THIN LAYER, METHOD FOR MAKING SPUTTERING TARGET AND SPUTTERING TARGET

COMPOSITION FOR SPUTTERING TARGET OF OXIDE SEMICONDUCTOR THIN LAYER, METHOD FOR MAKING SPUTTERING TARGET AND SPUTTERING TARGET

机译:氧化物半导体薄层的溅射靶的组成,溅射靶的制造方法及溅射靶

摘要

PURPOSE: A composition for a sputtering target of an oxide semiconductor thin film, a method for manufacturing the sputtering target, and the sputtering target are provided to obtain a transparent oxide semiconductor film showing high mobility through a low-temperature process less than 300C. CONSTITUTION: A method for manufacturing a sputtering target comprises the following steps: blending(S11) and crashing raw material powder consisting of aluminum oxide, zinc oxide, and tin oxide; molding(S12) the powder in a desired form; fist calcinating a molding product at 500 - 1000C; pulverizing and mixing the molding product which is fist calcinated; and molding the mixed powder; sintering(S13) the molding product. Indium oxide is more included in the raw material powder.
机译:目的:提供氧化物半导体薄膜的溅射靶用组合物,该溅射靶的制造方法和溅射靶,以通过低于300℃的低温工艺获得显示出高迁移率的透明氧化物半导体膜。组成:一种溅射靶的制造方法,包括以下步骤:将由氧化铝,氧化锌和氧化锡组成的原料粉末共混(S11)并粉碎。将粉末模制成所需的形式;在500-1000°C下煅烧成型产品的拳头;将经过煅烧的成型品粉碎并混合;将混合粉末成型;烧结(S13)模制品。原料粉末中还包含氧化铟。

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