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PROBE POLISHING METHOD, A PROGRAM THEREFOR, AND A PROBE APPARATUS, CAPABLE OF IMPLEMENTING AN ELECTRIC PROPERTY TEST OF AN OBJECT TO BE TESTED
PROBE POLISHING METHOD, A PROGRAM THEREFOR, AND A PROBE APPARATUS, CAPABLE OF IMPLEMENTING AN ELECTRIC PROPERTY TEST OF AN OBJECT TO BE TESTED
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机译:能够进行待测试对象的电气性能测试的探针抛光方法,其程序和探针设备
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摘要
PURPOSE: A probe polishing method, a program thereof, and probe apparatus are provided to detect abnormal material on upper face of a wafer and to eliminate foreign material authentically from a grinding wafer.;CONSTITUTION: A first accepting unit(20) accepts a grinding wafer. An image capturing unit(19A) photographs the upper side of the grinding wafer loaded on a mounting unit. A second accepting unit(21) accepts the grinding wafer detecting the foreign material with a imaging device.;COPYRIGHT KIPO 2010
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