首页> 外国专利> SEMICONDUCTOR DEVICE WITH A RECESS GATE AND A MANUFACTURING METHOD THEREOF, CAPABLE OF OBTAINING A LEAKAGE CURRENT PROPERTY AND A CURRENT DRIVING PROPERTY

SEMICONDUCTOR DEVICE WITH A RECESS GATE AND A MANUFACTURING METHOD THEREOF, CAPABLE OF OBTAINING A LEAKAGE CURRENT PROPERTY AND A CURRENT DRIVING PROPERTY

机译:具有闸门的半导体装置及其制造方法,能够获得泄漏电流特性和电流驱动特性

摘要

PURPOSE: A semiconductor device with a recess gate and a manufacturing method thereof are provided to suppress the deterioration of a leakage current property due to short channel effect by increasing the length of a channel through a first recess pattern and to improve a current driving property through a second recess pattern.;CONSTITUTION: A semiconductor device includes a substrate(101), a first insulation layer(103), a gate(111), a first recess pattern(106), and a second recess pattern(107). An active region is defined on the substrate by a device isolation layer. The first insulation layer is interposed between the device isolation layer and the active region. The gate crosses the device isolation layer, the first insulation layer, and the active region. The first recess pattern is formed on the active region under the gate. The second recess pattern is formed on the first insulation layer under the gate and is lower than the first recess pattern.;COPYRIGHT KIPO 2010
机译:目的:提供一种具有凹槽栅极的半导体器件及其制造方法,以通过增加通过第一凹槽图案的沟道的长度来抑制由于短沟道效应而引起的漏电流特性的劣化,并改善通过凹槽的电流驱动特性。组成:一种半导体器件,包括衬底(101),第一绝缘层(103),栅极(111),第一凹陷图案(106)和第二凹陷图案(107)。有源区通过器件隔离层在衬底上限定。第一绝缘层介于器件隔离层和有源区之间。栅极穿过器件隔离层,第一绝缘层和有源区。第一凹陷图案形成在栅极下方的有源区上。第二凹陷图案形成在栅极下方的第一绝缘层上,并且低于第一凹陷图案。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20100026222A

    专利类型

  • 公开/公告日2010-03-10

    原文格式PDF

  • 申请/专利权人 HYNIX SEMICONDUCTOR INC.;

    申请/专利号KR20080085139

  • 发明设计人 KIM YOUNG BOG;

    申请日2008-08-29

  • 分类号H01L29/78;H01L21/336;

  • 国家 KR

  • 入库时间 2022-08-21 18:33:10

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