CONTROLLING PASSIVATING FILM PROPERTIES USING COLLOIDAL PARTICLES POLYELECTROLYTES, AND IONIC ADDITIVES FOR COPPER CHEMICAL MECHANICAL PLANARIZATION

摘要

The present invention provides for a copper CMP slurry composition which comprises a complexing agent, an oxidizer, an abrasive and a passivating agent. The present invention also provides for a method of chemical mechanical planarization of a copper conductive structure which comprises administering the copper CMP slurry composition during the planarization process.;COPYRIGHT KIPO & WIPO 2010