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VERTICAL TYPE SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING THE SAME, CAPABLE OF REDUCING THE STEP VARIATION BETWEEN A CELL REGION AND A PERIPHERAL CIRCUIT REGION DURING A PLANARIZATION PROCESS
VERTICAL TYPE SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING THE SAME, CAPABLE OF REDUCING THE STEP VARIATION BETWEEN A CELL REGION AND A PERIPHERAL CIRCUIT REGION DURING A PLANARIZATION PROCESS
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机译:垂直型半导体器件及其形成方法,能够减少在平面化过程中细胞区域和周边电路区域之间的阶跃变化
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摘要
PURPOSE: A vertical type semiconductor device and a method for forming the same are provided to improve the resistance of the device to moisture and contamination by including a moisture proof structure in a dummy word line structure.;CONSTITUTION: A semiconductor substrate(100) includes a cell region(A) and a peripheral circuit region(B). A word line structure(170) vertically stacks a plurality of word lines in the cell region. A semiconductor structure(192) is arranged by passing through the word line structure. A gate insulation layer is arranged between the word line structure and the semiconductor structure. The height of a dummy word line structure(170d) is identical to the height of the word line structure. A moisture proof structure(220) passes through the dummy word line structure.;COPYRIGHT KIPO 2010
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