METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD, CAPABLE OF PREVENTING MISMATCH BETWEEN A VIA AND A CIRCUIT PATTERN

摘要

PURPOSE: A method for manufacturing a printed circuit board is provided to prevent the eccentricity of a via by forming a via hole on the center of an upper land.;CONSTITUTION: A substrate has a first circuit layer and a second circuit layer. A first circuit layer is formed on one side of an insulation material(100). The first circuit layer comprises a lower land(510). The second circuit layer is formed in the other side of the insulation material. The second circuit layer includes an upper land(310) corresponding to the lower land. The land hole is formed on the center of the upper land. A via hole is formed under the land hole of the upper land to expose the lower land. A via(900) is formed by filing the conductive metal in a via hole.;COPYRIGHT KIPO 2010