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METHOD AND AN APPARATUS FOR REMOVING METALLIC IMPURITIES USING AN ELECTRIC FIELD, CAPABLE OF PREVENTING THE RE-ABSORBENT OF THE METALLIC IMPURITIES ON A WAFER
METHOD AND AN APPARATUS FOR REMOVING METALLIC IMPURITIES USING AN ELECTRIC FIELD, CAPABLE OF PREVENTING THE RE-ABSORBENT OF THE METALLIC IMPURITIES ON A WAFER
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机译:用电场去除金属杂质的方法和装置,能够防止晶片上金属杂质的再吸收
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摘要
PURPOSE: A method and an apparatus for removing metallic impurities using an electric field are provided to clean a cleaning bath by trapping the metallic impurities in a cleaning solution using a cathode and an anode.;CONSTITUTION: The both end of a circulation unit are connected to a cleaning bath in order to circulate a cleaning solution in the cleaning bath. A trapping unit(100) is located on the path of the circulation unit. The trapping unit traps anion impurities and cation impurities in the cleaning solution. The trapping unit includes anode(110) for trapping cation and a cathode(120) for trapping anion.;COPYRIGHT KIPO 2010
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