首页> 外国专利> METHOD AND AN APPARATUS FOR REMOVING METALLIC IMPURITIES USING AN ELECTRIC FIELD, CAPABLE OF PREVENTING THE RE-ABSORBENT OF THE METALLIC IMPURITIES ON A WAFER

METHOD AND AN APPARATUS FOR REMOVING METALLIC IMPURITIES USING AN ELECTRIC FIELD, CAPABLE OF PREVENTING THE RE-ABSORBENT OF THE METALLIC IMPURITIES ON A WAFER

机译:用电场去除金属杂质的方法和装置,能够防止晶片上金属杂质的再吸收

摘要

PURPOSE: A method and an apparatus for removing metallic impurities using an electric field are provided to clean a cleaning bath by trapping the metallic impurities in a cleaning solution using a cathode and an anode.;CONSTITUTION: The both end of a circulation unit are connected to a cleaning bath in order to circulate a cleaning solution in the cleaning bath. A trapping unit(100) is located on the path of the circulation unit. The trapping unit traps anion impurities and cation impurities in the cleaning solution. The trapping unit includes anode(110) for trapping cation and a cathode(120) for trapping anion.;COPYRIGHT KIPO 2010
机译:目的:提供一种使用电场去除金属杂质的方法和设备,以通过使用阴极和阳极将金属杂质捕集在清洁溶液中来清洁清洁浴。;构成:连接循环单元的两端为了使清洁溶液在清洁浴中循环,将其倒入清洁浴中。捕获单元(100)位于循环单元的路径上。捕集单元捕集清洁溶液中的阴离子杂质和阳离子杂质。捕集单元包括用于捕集阳离子的阳极(110)和用于捕集阴离子的阴极(120)。;COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20100049857A

    专利类型

  • 公开/公告日2010-05-13

    原文格式PDF

  • 申请/专利权人 SILTRON INC.;

    申请/专利号KR20080108866

  • 发明设计人 OH SE YOUL;

    申请日2008-11-04

  • 分类号H01L21/302;H01L21/00;

  • 国家 KR

  • 入库时间 2022-08-21 18:32:46

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