首页> 外国专利> MANUFACTURING METHOD OF AN ELECTRO-CONDUCTIVE COPPER PATTERN LAYER CAPABLE OF FORMING A COPPER PATTERN PAYER WITH AN IMPROVED ELECTRIC CONDUCTANCE, AND A COPPER PATTERN LAYER FORMED THEREFROM

MANUFACTURING METHOD OF AN ELECTRO-CONDUCTIVE COPPER PATTERN LAYER CAPABLE OF FORMING A COPPER PATTERN PAYER WITH AN IMPROVED ELECTRIC CONDUCTANCE, AND A COPPER PATTERN LAYER FORMED THEREFROM

机译:能够形成具有改善的电导率的铜图案层的导电铜图案层的制造方法,以及以其为基础的铜图案层的制造方法

摘要

PURPOSE: A manufacturing method of an electro-conductive copper pattern layer, and a copper pattern layer formed therefrom are provided to form a copper pattern layer without preparing a space to maintain an inert gas atmosphere.;CONSTITUTION: A manufacturing method of an electro-conductive copper pattern layer comprises the following steps: preparing a reducing agent containing copper dispersion solution by mixing a copper group particle and a reducing agent; forming a reducing agent containing copper group particle pattern layer by printing or filling the dispersion solution to a base material with a constant shape; and plasticizing the pattern layer among air. The copper group particle is selected form the group consisting of a copper particle, a cuprous oxide particle and their mixture.;COPYRIGHT KIPO 2010
机译:目的:提供一种导电铜图案层的制造方法,以及由其形成的铜图案层,以形成铜图案层,而无需留出保持惰性气体气氛的空间。导电铜图案层包括以下步骤:通过将铜基颗粒和还原剂混合来制备包含铜分散溶液的还原剂;通过将分散溶液印刷或填充到恒定形状的基材中来形成含还原剂的铜族粒子图案层。使空气中的图案层塑化。铜基颗粒选自铜颗粒,氧化亚铜颗粒及其混合物。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20100050408A

    专利类型

  • 公开/公告日2010-05-13

    原文格式PDF

  • 申请/专利权人 LG CHEM. LTD.;

    申请/专利号KR20090104452

  • 发明设计人 KIM SANG HO;KIM SO WON;LEE WOO RAM;

    申请日2009-10-30

  • 分类号H01B1/22;H01L21/28;

  • 国家 KR

  • 入库时间 2022-08-21 18:32:45

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