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MANUFACTURING METHOD OF AN ELECTRO-CONDUCTIVE COPPER PATTERN LAYER CAPABLE OF FORMING A COPPER PATTERN PAYER WITH AN IMPROVED ELECTRIC CONDUCTANCE, AND A COPPER PATTERN LAYER FORMED THEREFROM
MANUFACTURING METHOD OF AN ELECTRO-CONDUCTIVE COPPER PATTERN LAYER CAPABLE OF FORMING A COPPER PATTERN PAYER WITH AN IMPROVED ELECTRIC CONDUCTANCE, AND A COPPER PATTERN LAYER FORMED THEREFROM
PURPOSE: A manufacturing method of an electro-conductive copper pattern layer, and a copper pattern layer formed therefrom are provided to form a copper pattern layer without preparing a space to maintain an inert gas atmosphere.;CONSTITUTION: A manufacturing method of an electro-conductive copper pattern layer comprises the following steps: preparing a reducing agent containing copper dispersion solution by mixing a copper group particle and a reducing agent; forming a reducing agent containing copper group particle pattern layer by printing or filling the dispersion solution to a base material with a constant shape; and plasticizing the pattern layer among air. The copper group particle is selected form the group consisting of a copper particle, a cuprous oxide particle and their mixture.;COPYRIGHT KIPO 2010
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