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PRESSURE CONTROL DEVICE FOR CORRECTING FLATNESS OF SUBSTRATES, WHICH EQUALIZES THE PLANARITY OF AN UPPER PLATEN
PRESSURE CONTROL DEVICE FOR CORRECTING FLATNESS OF SUBSTRATES, WHICH EQUALIZES THE PLANARITY OF AN UPPER PLATEN
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机译:用于校正平面平整度的压力控制装置,该平面平衡了上平台的平面度
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摘要
PURPOSE: A pressure control device for correcting flatness of substrates is provided to secure the uniform planarity of product and total thickness variation.;CONSTITUTION: A pressure control device for correcting flatness of substrates comprises a plurality of pressure controllers. A pressure controlling part gives pressure at least over one spot of the outer circumference of an upper platen(200), and corrects a planarity of the substrate. The pressure controlling part comprises a pressure settling unit(120) and a pressure adjustment unit(110a). The pressure settling unit forms a supporting force. The pressure adjustment unit connected to the pressure settling unit gives a tensile force to outside.;COPYRIGHT KIPO 2010
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