首页> 外国专利> PRESSURE CONTROL DEVICE FOR CORRECTING FLATNESS OF SUBSTRATES, WHICH EQUALIZES THE PLANARITY OF AN UPPER PLATEN

PRESSURE CONTROL DEVICE FOR CORRECTING FLATNESS OF SUBSTRATES, WHICH EQUALIZES THE PLANARITY OF AN UPPER PLATEN

机译:用于校正平面平整度的压力控制装置,该平面平衡了上平台的平面度

摘要

PURPOSE: A pressure control device for correcting flatness of substrates is provided to secure the uniform planarity of product and total thickness variation.;CONSTITUTION: A pressure control device for correcting flatness of substrates comprises a plurality of pressure controllers. A pressure controlling part gives pressure at least over one spot of the outer circumference of an upper platen(200), and corrects a planarity of the substrate. The pressure controlling part comprises a pressure settling unit(120) and a pressure adjustment unit(110a). The pressure settling unit forms a supporting force. The pressure adjustment unit connected to the pressure settling unit gives a tensile force to outside.;COPYRIGHT KIPO 2010
机译:目的:提供一种用于校正基板平整度的压力控制装置,以确保产品的均匀平面度和总厚度变化。;构成:一种用于校正基板平整度的压力控制装置,包括多个压力控制器。压力控制部分至少在上压板(200)的外周的一个点上施加压力,并校正基板的平面性。压力控制部包括压力稳定单元(120)和压力调节单元(110a)。压力沉降单元形成支撑力。连接到压力沉降单元的压力调节单元向外界施加拉力。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20100069788A

    专利类型

  • 公开/公告日2010-06-25

    原文格式PDF

  • 申请/专利权人 LG INNOTEK CO. LTD.;

    申请/专利号KR20080128311

  • 发明设计人 KIM TAE KYUNG;

    申请日2008-12-17

  • 分类号B24B37/04;B24B9/00;

  • 国家 KR

  • 入库时间 2022-08-21 18:32:27

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