THERMOELECTRIC COOLER FOR FLIP-CHIP SEMICONDUCTOR DEVICES, WHICH ADOPTS THERMOELECTRIC STRUCTURES AND A THROUGH-SILICON-VIA

摘要

PURPOSE: A thermoelectric cooler for flip-chip semiconductor devices is provided to improve cooling efficiency by blocking feedback-heating by super lattice layers.;CONSTITUTION: A thermoelectric structure includes a first type super lattice layer(120) and a second type super lattice layer(130). The first type super lattice layer is formed on the upper side of an IC chip and is connected to a first voltage. A second type super lattice layer is formed on the lower side of the IC chip and is connected to a second voltage different from the first voltage. An active conducting current flows through first and second type super lattice layers to cool the IC chip. The first and second type super lattice layers are connected to first and second main power supply metal layers of the IC chip. A lower metal layer is formed on the lower side of the second type super lattice layer.;COPYRIGHT KIPO 2010