SEMICONDUCTOR PACKAGE INCLUDING A SOLDER BALL HAVING A DOUBLE CONNECTION STRUCTURE WHICH IMPLEMENTS A CONNECTION PROCESS AND A SOLDER BALL ATTACHING PROCESS AT THE SAME TIME

摘要

PURPOSE: A semiconductor package including a solder ball having a double connection structure is provided to reduce the overall height of the semiconductor package by attaching a solder ball only for a first semiconductor package arranged on a lower part in a POP(Package On Package) which has the upper side and the bottom are connected.;CONSTITUTION: A through hole(112) is formed on the inside of a first substrate(110). A conductor(120) is formed on a sidewall of the penetration hole. A solder ball connects a contact point of the conductor and the semiconductor device. The semiconductor chip is loaded on the upper side of the second substrate. A wire connects the semiconductor chip and the second substrate.;COPYRIGHT KIPO 2010