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LIGHT EMITTING DIODE WHICH HAS INCREASED LIGHTING AREA BY PREVENTING THE AREA REDUCTION OF AN ACTIVE LAYER ADJACENT TO A CHIP DUE TO A WIRE BONDING PROCESS
LIGHT EMITTING DIODE WHICH HAS INCREASED LIGHTING AREA BY PREVENTING THE AREA REDUCTION OF AN ACTIVE LAYER ADJACENT TO A CHIP DUE TO A WIRE BONDING PROCESS
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机译:通过防止由于引线键合过程而使与芯片相邻的有源层的面积减少而增加了照明面积的发光二极管
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摘要
PURPOSE: A light emitting diode is provided to improve the intensity of light by preventing the area reduction of an active layer adjacent to a chip due to a wire bonding process.;CONSTITUTION: A first n-hole passing through an upper side and a lower side is formed on a substrate. A n-type clad layer(330) is formed on the upper part of the substrate. A second n-hole which is connected to the first n-hole is formed. An active layer(340) is formed on the n-type clad layer. A p-type clad layer is formed on the active layer. An n-ohmic conductive layer(360) is formed inside the first n-hole and the second n-hole and is ohmic-contacted with the n-type clad layer.;COPYRIGHT KIPO 2010
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