METHOD FOR MANUFACTURING A LIGHT EMITTING DIODE UNIT AND THE LIGHT EMITTING DIODE UNIT MANUFACTURED BY THE SAME, CAPABLE OF SIMPLIFYING MANUFACTURING PROCESSES

摘要

PURPOSE: A method for manufacturing a light emitting diode unit and the light emitting diode unit manufactured by the same are provided to reduce the thickness of a whole structure of the light emitting diode unit by forming a heat radiating plate into a integrated shape.;CONSTITUTION: An upper substrate(10) including an aperture is prepared. A heat radiating substrate(20) is formed in a lower substrate. The upper substrate is adhered to the lower substrate using an adhesive layer(22). A light diode chip is mounted on the adhesive layer of the aperture of the upper substrate. The n-type pad and the p-type pad of the light emitting diode are bonded to an upper electrical conductive layer through a wire-bonding process. A molding process is performed to cover the aperture of the upper substrate and a wire-bonded part.;COPYRIGHT KIPO 2010