首页> 外国专利> MANUFACTURING METHOD OF THE PIEZO-ELECTRIC RESONATOR WHICH AUTHENTICALLY MOUNTS THE PIEZOELECTRIC OSCILLATION PIECE WITH THE FLIP CHIP BONDING, AND THE PIEZO-ELECTRIC RESONATOR AND OSCILLATOR

MANUFACTURING METHOD OF THE PIEZO-ELECTRIC RESONATOR WHICH AUTHENTICALLY MOUNTS THE PIEZOELECTRIC OSCILLATION PIECE WITH THE FLIP CHIP BONDING, AND THE PIEZO-ELECTRIC RESONATOR AND OSCILLATOR

机译:正确安装带有倒装芯片键合的压电振动片的压电谐振器,压电谐振器和振荡器的制造方法

摘要

PURPOSE: The manufacturing method of the piezo-electric resonator, and the piezo-electric resonator and oscillator mount in order to Do JungE locate the leading end of the metal bump of the mount electrode. The bond strength of the mount electrode and metal bump is enhanced.;CONSTITUTION: The lead substrate(3) forms cavity between the Base substrate(2). The aftershock electrode(5) is formed in the warped surface of the quartz plat. In the piezoelectric oscillation piece(4), the mount electrode electrically connected to the aftershock electrode is formed. The circuital electrode(9) is formed on the Base substrate.;COPYRIGHT KIPO 2011
机译:用途:压电谐振器的制造方法,以及压电谐振器和振荡器底座,以便Do JungE定位底座电极的金属凸点的前端。装配电极和金属凸块的结合强度得到了增强。;组成:引线基板(3)在基础基板(2)之间形成空腔。余震电极(5)形成在石英板的弯曲表面中。在压电振动片(4)中,形成与余震电极电连接的安装电极。电路电极(9)形成在基础基板上。; COPYRIGHT KIPO 2011

著录项

  • 公开/公告号KR20100092916A

    专利类型

  • 公开/公告日2010-08-23

    原文格式PDF

  • 申请/专利权人 SEIKO INSTRUMENTS INC.;

    申请/专利号KR20100013581

  • 发明设计人 SAYAMA KIYOTAKA;

    申请日2010-02-12

  • 分类号H01L41/08;

  • 国家 KR

  • 入库时间 2022-08-21 18:32:02

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号