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MANUFACTURING METHOD OF THE PIEZO-ELECTRIC RESONATOR WHICH AUTHENTICALLY MOUNTS THE PIEZOELECTRIC OSCILLATION PIECE WITH THE FLIP CHIP BONDING, AND THE PIEZO-ELECTRIC RESONATOR AND OSCILLATOR
MANUFACTURING METHOD OF THE PIEZO-ELECTRIC RESONATOR WHICH AUTHENTICALLY MOUNTS THE PIEZOELECTRIC OSCILLATION PIECE WITH THE FLIP CHIP BONDING, AND THE PIEZO-ELECTRIC RESONATOR AND OSCILLATOR
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机译:正确安装带有倒装芯片键合的压电振动片的压电谐振器,压电谐振器和振荡器的制造方法
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摘要
PURPOSE: The manufacturing method of the piezo-electric resonator, and the piezo-electric resonator and oscillator mount in order to Do JungE locate the leading end of the metal bump of the mount electrode. The bond strength of the mount electrode and metal bump is enhanced.;CONSTITUTION: The lead substrate(3) forms cavity between the Base substrate(2). The aftershock electrode(5) is formed in the warped surface of the quartz plat. In the piezoelectric oscillation piece(4), the mount electrode electrically connected to the aftershock electrode is formed. The circuital electrode(9) is formed on the Base substrate.;COPYRIGHT KIPO 2011
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