MANUFACTURING METHOD FOR EMBEDDED PCB, AND EMBEDDED PCB STRUCTURE USING THE SAME

摘要

PURPOSE: An embedded substrate manufacturing method and an embedded substrate structure thereof are provided to manufacture a symmetrically structured substrate without a cavity by applying a flip lay-up method to a FCCL(Flexible Copper Clad Laminate) lamination process. CONSTITUTION: A Cu layer(120) is laminated on the upper side of a FCCL(110). A DFR(Dry Film Resist) stripping process is executed. A DAF(Die Attach Film)(155) is attached to the lower part of a semiconductor chip(130). The semiconductor chip is bonded in the DFR stripped region. A BVH/TH(Blind Via Hole/Through Hole) drilling process is executed. An electroless copper plating process(160) is executed on the lower surface of the FCCL.