Chip embedded PCB(printed circuit board) and semiconductor package using the PCB, and manufacturing method of the PCB

摘要

The present invention relates to a chip embedded printed circuit board, a semiconductor package using the same, and a method for manufacturing a chip embedded printed circuit board. A semiconductor package using a chip-embedded printed circuit board according to the present invention includes upper and lower semiconductor packages having a PoP structure, and a lower semiconductor package includes a base substrate including a predetermined circuit pattern therein; An electronic component that is electrically connected to the circuit pattern and is installed on a base substrate such that one surface is exposed to an upper surface of the base substrate; And a heat dissipation member installed on the exposed surface of the electronic component and dissipating heat generated from the electronic component to the outside. According to the present invention, a semiconductor package product having excellent heat dissipation function can be manufactured, and accordingly, reliability of the product can be improved.