PROTECTION TAPE REMOVING METHOD CAPABLE OF CONTROLLING THE REMOVAL SPEED OF THE PROTECTION TAPE BASED ON THE DETECTION INFORMATION AND A PROTECTION TAPE REMOVING APPARATUS USING THE SAME

摘要

PURPOSE: A protection tape removing method and a protection tape removing apparatus using the same are provided to remove the protection tape from the surface of a semiconductor wafer as one body with the removal tape by attaching the protection tape attached on the semiconductor wafer surface to the removal tape before removing.;CONSTITUTION: A cassette(C1) loaded with a semiconductor wafer(W) is loaded on a wafer supplying unit(1). A wafer transferring apparatus(3) includes a robot arm(2). A tape supplying unit(5) supplies the adhesive tape(T) for removing to a removing process area. A tape removing apparatus(8) removes the attached removing tape.;COPYRIGHT KIPO 2011