PROTECTION TAPE ATTACHING METHOD AND A PROTECTION TAPE ATTACHING DEVICE THEREOF, CAPABLE OF ATTACHING A PROTECTION TAPE ON A SEMICONDUCTOR WAFER

摘要

PURPOSE: A protection tape attaching method and a protection tape attaching device thereof are provided to implement the superb tape attaching job avoiding wrinkle while transferring a semiconductor wafer between a protection tape and a retaining support table.;CONSTITUTION: A wafer return apparatus(3) comprises a robot arm(2). A tape server(6) supplies the protection tape for the surface protection to a wafer(W). A separator returning unit(7) collects a separator(s) from the protection tape. An attachment unit(8) attaches the protection tape to the supported wafer.;COPYRIGHT KIPO 2011