RESIN COMPOSITION FOR A PRINTED CIRCUIT BOARD WITH THE EXCELLENT TOUGHNESS WHEN BEING APPLIED TO A MULTIAYER PRINTED CIRCUIT BOARD, AND THE PRINTED CIRCUIT BOARD USING THEREOF

摘要

PURPOSE: A resin composition for a printed circuit board, and the printed circuit board using thereof are provided to prevent a micro crack and the delamination of the printed circuit board during a thermal shock test.;CONSTITUTION: A resin composition for a printed circuit board contains a complex epoxy resin, a bisphenol A system hardener, a curing accelerator, and an inorganic filler. The complex epoxy resin includes thereof: 20~50wt% of bisphenol A type epoxy resin dispersed with silicon elastomer particles with a core-shell structure; 20~60wt% of cresol novolak epoxy resin; and 20~30wt% of phosphorous-based epoxy resin.;COPYRIGHT KIPO 2011