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GLOBAL PLANARIZATION METHOD FOR ELECTRODE OF CONTACT-TYPE CAPACITIVE SENSOR, WHICH FLATTENS AN ELECTRODE PATTERN, IN WHICH METAL IS FILLED, TOWARD A SUBSTRATE OF A NON-METALLIC MATERIAL
GLOBAL PLANARIZATION METHOD FOR ELECTRODE OF CONTACT-TYPE CAPACITIVE SENSOR, WHICH FLATTENS AN ELECTRODE PATTERN, IN WHICH METAL IS FILLED, TOWARD A SUBSTRATE OF A NON-METALLIC MATERIAL
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机译:填充金属的接触型电容式传感器电极的整体平面化方法,向非金属材料的基质过渡
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摘要
PURPOSE: A global planarization method for electrode of contact-type capacitive sensor, which flattens an electrode pattern, in which metal is filled, toward a substrate of a non-metallic material is provided to reduce signal noise by pattern collision.;CONSTITUTION: A global planarization method for electrode of contact-type capacitive sensor is as follows. Each substrate(100) of a moving element and a fixed element is etched in fixed shape. An electrode material(200) is filled in the etched place. CMP is performed until the filled electrode material has fixed depth. A coating layer is evaporated on the formed electrode. The substrate is composed of a glass wafer. The electrode material is made of chrome.;COPYRIGHT KIPO 2011
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