首页> 外国专利> REFORMING METHOD OF A METAL PATTERN, AN ARRAY SUBSTRATE, AND A METHOD FOR MANUFACTURING THE ARRAY SUBSTRATE, CAPABLE OF INCREASING RELIABILITY OF PRODUCTIVITY AND MANUFACTURE PROCESSES

REFORMING METHOD OF A METAL PATTERN, AN ARRAY SUBSTRATE, AND A METHOD FOR MANUFACTURING THE ARRAY SUBSTRATE, CAPABLE OF INCREASING RELIABILITY OF PRODUCTIVITY AND MANUFACTURE PROCESSES

机译:金属图案的变形方法,阵列基质以及制造阵列基质的方法,能够提高生产率和制造过程的可靠性

摘要

PURPOSE: A reforming method of a metal pattern, an array substrate, and a method for manufacturing the array substrate are provided to use an engraving pattern as an align mark, thereby increasing align reliability of the second wire pattern formed on an insulation substrate.;CONSTITUTION: The second photo pattern(300) is formed on the second wiring layer(130b). The second photo pattern uses an engraving pattern(114) as an align mark. The second buffer layer(120b) is actually the same as the first buffer layer. The second wiring layer is actually the same as the first wiring layer.;COPYRIGHT KIPO 2011
机译:目的:提供一种金属图案的重整方法,阵列基板以及用于制造阵列基板的方法,以使用雕刻图案作为对准标记,从而提高在绝缘基板上形成的第二布线图案的对准可靠性。构成:第二光图案(300)形成在第二布线层(130b)上。第二照片图案使用雕刻图案(114)作为对准标记。第二缓冲层(120b)实际上与第一缓冲层相同。第二布线层实际上与第一布线层相同。; COPYRIGHT KIPO 2011

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