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PACKAGING METHOD OF A LIGHT EMITTING DIODE, CAPABLE OF ENHANCING PRODUCTIVITY AND ACCURACY OF THE LIGHT EMITTING DIODE
PACKAGING METHOD OF A LIGHT EMITTING DIODE, CAPABLE OF ENHANCING PRODUCTIVITY AND ACCURACY OF THE LIGHT EMITTING DIODE
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机译:一种能够提高发光二极管的生产率和精度的发光二极管的包装方法
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摘要
PURPOSE: A packaging method of a light emitting diode(LED) is provided to simplify a packaging operation by pressurizing and heating a reflector and a printed circuit board which include an adhesive sheet in between.;CONSTITUTION: A reflector is manufactured through an injection molding method(S1). An adhesive sheet of a plate shape forming a plurality of holes is manufactured by press punching(S2). A printed circuit board is welded(S3) by pressurizing and heating the printed circuit board and the reflector. An LED is mounted on the printed circuit board which has passed the reflector attachment stage. The LED is separated with a cutting laser(S4).;COPYRIGHT KIPO 2010
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