HEAD PART DEVICE OF AN LED DIE BONDER, CAPABLE OF BEING ADAPTED TO WIDTH VARIATIONS OF VARIOUS LED LEAD FRAMES

摘要

PURPOSE: A head part device of an LED die bonder is provided to maintain a stable process flow by using a one body shaped casting base in order to have the durability against vibrations and deformation.;CONSTITUTION: A head part comprises an epoxy device for dotting the epoxy in the pad of a lead frame which is transferred with a feeding device. The head part comprises a chip bonding device which attaches a chip to the pad of a lead frame where an epoxy dotting work is completed from the epoxy device by separating a chip from a wafer sheet. A base(500) supports the epoxy device, a chip bonding device, and a camera part. The camera part is composed of an epoxy camera(410) which detects a lead frame before the epoxy dotting and the chip attachment, a mount camera(420), and a wafer camera(430) which recognizes the chip of the wafer sheet.;COPYRIGHT KIPO 2010