ELECTROLESS PLATING CATALYST FOR PRINTED WIRING BOARD HAVING THROUGH HOLE, AND PRINTED WIRING BOARD HAVING THROUGH HOLE PROCESSED BY USING SUCH CATALYST

摘要

Provided is an electroless plating catalyst, by which uniform electroless plating can be performed without generating voids on a through hole side wall, even to a printed wiring board with a through hole having a diameter of 200µm or less due to high integration of the printed wiring board. The electroless plating catalyst to be used for printed wiring boards having through holes is characterized in that the catalyst includes a compound having a functional group which can capture a noble metal in a molecule, and a noble metal compound.