首页> 外国专利> Manufacturing a mold, comprises depositing electrically conductive layer on top and bottom of plate, soldering plate with substrate using adhesive layer, removing part of top conductive layer from plate, and etching the plate

Manufacturing a mold, comprises depositing electrically conductive layer on top and bottom of plate, soldering plate with substrate using adhesive layer, removing part of top conductive layer from plate, and etching the plate

机译:制造模具,包括:在板的顶部和底部上沉积导电层;使用粘合剂层将板与基板焊接;从板上去除顶部导电层的一部分;以及蚀刻板

摘要

The process comprises depositing an electrically conductive layer on a top and bottom of a plate (21) made of silicon-based material, soldering the plate with a substrate (23) using an adhesive layer (24), removing a part of the top conductive layer (20) from the plate, etching the plate up to the conductive layer according to a shape of the removed part of the conductive layer to form a cavity of a mold, and mounting a silicon-based material piece on the top conductive layer of the plate to form a second level of the mold by structuring a photosensitive resin using photolithography. The process comprises depositing an electrically conductive layer on a top and bottom of a plate (21) made of silicon-based material, soldering the plate with a substrate (23) using an adhesive layer (24), removing a part of the top conductive layer (20) from the plate, etching the plate up to the conductive layer according to a shape of the removed part of the conductive layer to form a cavity of a mold, and mounting a silicon-based material piece on the top conductive layer of the plate to form a second level of the mold by structuring a photosensitive resin using photolithography. A rod is finally formed in the cavity to form a hole in the piece. The photosensitive resin is present in an adhesive layer, which is different from the top conductive layer. The substrate is made of silicon-based material and etched up to a bottom conductive layer (22) to form an opening of the mold. A piece (27) is mounted to a bottom of the substrate to form an additional level of the mold. The etching step is carried out by structuring a protection mask on the top conductive layer by photolithography using the resin, producing an anisotropic attack on the plate according to the parts non-covered by the protection mask, and removing the mask.
机译:该方法包括在由硅基材料制成的板(21)的顶部和底部上沉积导电层,使用粘合剂层(24)将板与基板(23)焊接,去除顶部导电层的一部分。从该板的层(20)开始,根据该导电层的被去除部分的形状蚀刻该板直至该导电层以形成模具的腔,并且在该导电层的顶部导电层上安装硅基材料片。通过使用光刻结构化光敏树脂,使板形成模具的第二层。该方法包括在由硅基材料制成的板(21)的顶部和底部上沉积导电层,使用粘合剂层(24)将板与基板(23)焊接,去除顶部导电层的一部分。从该板的层(20)开始,根据该导电层的被去除部分的形状蚀刻该板直至该导电层以形成模具的腔,并且在该导电层的顶部导电层上安装硅基材料片。通过使用光刻结构化光敏树脂,使板形成模具的第二层。最终在腔中形成杆以在部件中形成孔。光敏树脂存在于粘合剂层中,该粘合剂层不同于顶部导电层。基板由硅基材料制成,并蚀刻到底部导电层(22)以形成模具的开口。一块(27)被安装到衬底的底部以形成模具的附加水平。蚀刻步骤是通过使用树脂通过光刻在顶部导电层上构造保护掩模,根据未被保护掩模覆盖的部分在板上产生各向异性侵蚀,以及去除掩模而进行的。

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