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Manufacturing a mold, comprises depositing electrically conductive layer on top and bottom of plate, soldering plate with substrate using adhesive layer, removing part of top conductive layer from plate, and etching the plate
Manufacturing a mold, comprises depositing electrically conductive layer on top and bottom of plate, soldering plate with substrate using adhesive layer, removing part of top conductive layer from plate, and etching the plate
The process comprises depositing an electrically conductive layer on a top and bottom of a plate (21) made of silicon-based material, soldering the plate with a substrate (23) using an adhesive layer (24), removing a part of the top conductive layer (20) from the plate, etching the plate up to the conductive layer according to a shape of the removed part of the conductive layer to form a cavity of a mold, and mounting a silicon-based material piece on the top conductive layer of the plate to form a second level of the mold by structuring a photosensitive resin using photolithography. The process comprises depositing an electrically conductive layer on a top and bottom of a plate (21) made of silicon-based material, soldering the plate with a substrate (23) using an adhesive layer (24), removing a part of the top conductive layer (20) from the plate, etching the plate up to the conductive layer according to a shape of the removed part of the conductive layer to form a cavity of a mold, and mounting a silicon-based material piece on the top conductive layer of the plate to form a second level of the mold by structuring a photosensitive resin using photolithography. A rod is finally formed in the cavity to form a hole in the piece. The photosensitive resin is present in an adhesive layer, which is different from the top conductive layer. The substrate is made of silicon-based material and etched up to a bottom conductive layer (22) to form an opening of the mold. A piece (27) is mounted to a bottom of the substrate to form an additional level of the mold. The etching step is carried out by structuring a protection mask on the top conductive layer by photolithography using the resin, producing an anisotropic attack on the plate according to the parts non-covered by the protection mask, and removing the mask.
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