Device for thermal treatment of workpieces, comprises printed circuit boards equipped with electric and electronic component, and a process chamber in which a heating/cooling device is formed and/or arranged on heating and/or cooling zone

摘要

The device for thermal treatment of workpieces, comprises printed circuit boards equipped with electric and electronic component, and a process chamber (1) in which a heating or cooling device is formed and/or arranged on heating and/or cooling zone. The workpiece is transported under heating or cooling along a path through the heating and/or cooling zone. A pressurized gaseous fluid is introduced over inflow opening in the heating or cooling zone. The inflow openings are arranged on a pipeline section (5) that is connected with a pressurized fluid source. The device for thermal treatment of workpieces, comprises printed circuit boards equipped with electric and electronic component, and a process chamber (1) in which a heating or cooling device is formed and/or arranged on heating and/or cooling zone. The workpiece is transported under heating or cooling along a path through the heating and/or cooling zone. A pressurized gaseous fluid is introduced over inflow opening in the heating or cooling zone. The inflow openings are arranged on a pipeline section (5) that is connected with a pressurized fluid source, or on a wall of a hollow chamber that is connected with the fluid source. The wall is a part of external wall of the process chamber. The pipeline section is arranged in the process chamber that passes parallel to the transport direction of the workpiece or passes diagonal or angularly to the transport direction. The inflow openings are arranged side by side at the pipeline section or transferred angularly against each other. The distance of the pipeline sections from the workpiece to be treated is 20-50 mu m. The pipeline sections are adjustable in its interval from one another and/or from the workpiece to be treated and are rotatable along its longitudinal axis. The inflow openings have a diameter of 0.5-0.05 mm and an interval of 5-100 mm. The pressure difference between the process chamber and the pressurized fluid is 1-50 bar. The heating or cooling device has a rod- or tube shaped surface heating- or cooling element that is arranged on the side of the pipeline sections opposite to the workpiece to be treated, between the pipeline sections and the workpiece or between the adjoining pipeline sections.