首页> 外国专利> Camera module for e.g. mobile phone, has frame having supporting portion and bearing portion extending inward from supporting portion for supporting infrared-cut transparent cover of lower lens unit

Camera module for e.g. mobile phone, has frame having supporting portion and bearing portion extending inward from supporting portion for supporting infrared-cut transparent cover of lower lens unit

机译:相机模块,例如移动电话,具有框架,该框架具有支撑部分和从该支撑部分向内延伸的轴承部分,用于支撑下透镜单元的红外切割透明盖

摘要

An image sensor chip module (20) has image sensor chip (22) arranged on base (21), and frame (24) positioned on base to surround the chip. Lens module (10) is provided with barrel (11) having lens unit (12,13) mounted on frame. Lens unit (13) is provided with transparent cover (132) capable of filtering infrared rays out and separating lens unit (12) away from the chip. Frame is provided with supporting portion (241) and bearing portion (242) extending inward from supporting portion for supporting the cover. Barrel and lens module are arranged on bearing portion. An independent claim is included for manufacturing method of camera module.
机译:图像传感器芯片模块(20)具有布置在基座(21)上的图像传感器芯片(22)和定位在基座上以围绕该芯片的框架(24)。透镜模块(10)具有镜筒(11),镜筒(11)具有安装在框架上的透镜单元(12,13)。透镜单元(13)设置有透明罩(132),该透明罩能够将红外线滤出并使透镜单元(12)与芯片分离。框架设置有支撑部分(241)和从支撑部分向内延伸的用于支撑盖的轴承部分(242)。镜筒和透镜模块布置在轴承部分上。相机模块的制造方法包括独立权利要求。

著录项

  • 公开/公告号DE102008046755A1

    专利类型

  • 公开/公告日2010-03-25

    原文格式PDF

  • 申请/专利权人 CHENG UEI PRECISION INDUSTRY CO. LTD.;

    申请/专利号DE20081046755

  • 发明设计人 WENG NIEN-TING;LIN SHENG-YUAN;

    申请日2008-09-11

  • 分类号G03B11/00;G02B7/02;H04N5/225;G02B5/20;

  • 国家 DE

  • 入库时间 2022-08-21 18:28:44

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