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Camera module for e.g. mobile phone, has frame having supporting portion and bearing portion extending inward from supporting portion for supporting infrared-cut transparent cover of lower lens unit
Camera module for e.g. mobile phone, has frame having supporting portion and bearing portion extending inward from supporting portion for supporting infrared-cut transparent cover of lower lens unit
An image sensor chip module (20) has image sensor chip (22) arranged on base (21), and frame (24) positioned on base to surround the chip. Lens module (10) is provided with barrel (11) having lens unit (12,13) mounted on frame. Lens unit (13) is provided with transparent cover (132) capable of filtering infrared rays out and separating lens unit (12) away from the chip. Frame is provided with supporting portion (241) and bearing portion (242) extending inward from supporting portion for supporting the cover. Barrel and lens module are arranged on bearing portion. An independent claim is included for manufacturing method of camera module.
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