A method for positioning and / or guiding at least one of any desired process head for the metallization of thin substrates in a defined distance above the substrate surface

摘要

The invention relates to a method for positioning and / or guiding at least one of any desired process head (print head) or of a printing unit with at least one pressure nozzle for the metallization (printing) of thin substrates such as wafers in a defined distance above the surface of the on a support (paddle; printing table) to be provided substrate (wafer). In order to the plane of the opening of the pressure nozzle of the printing head to the surface of the on the support table substrate (wafer) to be positioned in a plane parallel fashion and to adjust the plane-parallel setting during the printing process, on the print head distance sensors are provided, via the in the case of the distance measurement to the surface of the substrate to be printed (wafer) is continuously measured data obtained by means of process actuators for an adjustment of the print head in up to 6 degrees of freedom is provided in such a way that the plane of the opening of the pressure nozzle of the print head is in a plane parallel to the plane of the surface of the substrate to be printed (wafer) is set, is maintained and / or can be readjusted.