Metallizing system is a semiconductor component having, in addition, tapered via gear contacts

摘要

In a metallization system of a semiconductor component, a contact by means of gear by means of the guiding with a larger degree of taper is provided, by providing a corresponding sequence is modified etching. For example, the resist mask for the preparation of the opening of the contact is eroded once or several times, so that the lateral size of the corresponding mask opening, to increase. On the basis of the pronounced degree of taper are better separation conditions during the subsequent electrochemical deposition process for the joint filling of the contact opening and a wide associated trench is created.