首页> 外国专利> Thermal conversion of metallic precursor layer into semiconductor layer in thin layer solar cell, involves introducing chalcogen vapor/carrier gas mixture on substrate having precursor layer, heating, converting and cooling

Thermal conversion of metallic precursor layer into semiconductor layer in thin layer solar cell, involves introducing chalcogen vapor/carrier gas mixture on substrate having precursor layer, heating, converting and cooling

机译:将金属前驱物层热转换为薄层太阳能电池中的半导体层,包括将硫属元素蒸气/载气混合物引入具有前驱物层的基板上,加热,转换和冷却

摘要

An inlet and outlet side gas lock (4.1,4.2,4.3,4.4) for oxygen-tight closure of a furnace chamber (1) is formed. One or more substrates (6) prepared with at least one metallic precursor layer (7) are introduced into chamber. A chalcogen vapor/carrier gas mixture (10) is introduced on substrate. The substrate is heated in chalcogen vapor/carrier gas atmosphere to a final temperature and precursor layers are converted into semiconducting layers. The gas mixture not consumed in the reaction is removed, substrate is cooled and substrate is removed from chamber. An inlet and outlet side gas lock for oxygen-tight closure of a furnace chamber is formed. One or more substrates prepared with at least one metallic precursor layer are introduced into chamber. A chalcogen vapor/carrier gas mixture is introduced on substrate, and mixture is uniformly distributed along width of substrate. The substrate is heated in chalcogen vapor/carrier gas atmosphere to a final temperature and precursor layers are converted into semiconducting layers. The gas mixture not consumed in the reaction is removed, substrate is cooled and substrate is removed from chamber. An independent claim is included for device for thermal conversion of metallic precursor layer.
机译:形成用于氧气密闭炉腔(1)的入口和出口侧气闸(4.1、4.2、4.3、4.4)。将准备有至少一个金属前驱体层(7)的一个或多个基板(6)引入腔室。将硫属元素蒸气/载气混合物(10)引入基材上。在硫属元素蒸气/载气气氛中将衬底加热到​​最终温度,并且将前体层转换成半导体层。除去反应中未消耗的气体混合物,冷却底物,并从室中取出底物。形成用于氧气密闭炉腔的入口和出口侧气闸。将制备有至少一层金属前体层的一种或多种基底引入腔室。硫属元素蒸气/载气混合物被引入到基板上,并且混合物沿着基板的宽度均匀地分布。在硫属元素蒸气/载气气氛中将衬底加热到​​最终温度,并且将前体层转换成半导体层。除去反应中未消耗的气体混合物,冷却底物,并从室中取出底物。对于用于金属前体层的热转化的装置包括独立权利要求。

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