首页> 外国专利> Direct-converting x-ray detector for use in computed tomography system, has doped semiconductor material formed as detector material i.e. indium phosphide, where detector material is doped with element of auxiliary group of periodic system

Direct-converting x-ray detector for use in computed tomography system, has doped semiconductor material formed as detector material i.e. indium phosphide, where detector material is doped with element of auxiliary group of periodic system

机译:用于计算机断层摄影系统的直接转换X射线检测器已掺杂了形成为检测器材料的半导体材料,即磷化铟,其中检测器材料中掺有周期性系统辅助组的元素

摘要

The detector has a doped semiconductor material formed as a detector material i.e. indium phosphide, where the detector material is doped with an element of an auxiliary group of a periodic system. The element is selected from one of iron, osmium, and ruthenium. Thickness of the detector material is from 1.2 mm to 3.0 mm. The detector material is built from two layers, where total thickness of the layers lies between from 1.2 mm to 3.0 mm. Total thickness of the layers lies between from 1.4 mm to 2.4 mm. Breakdown field strength of the indium phosphide is 100 kilo volts/cm.
机译:该检测器具有形成为检测器材料的掺杂半导体材料,即磷化铟,其中该检测器材料掺杂有周期性系统的辅助基团的元素。该元素选自铁,和钌之一。检测器材料的厚度为1.2毫米至3.0毫米。探测器材料由两层构成,其中两层的总厚度介于1.2毫米至3.0毫米之间。层的总厚度在1.4mm至2.4mm之间。磷化铟的击穿场强为100千伏/厘米。

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