Module, particularly sensor module, is provided with component and connecting element, where component is connected to another component in electrically conductive manner

摘要

The module (1) is provided with a component (2) and a connecting element (8), where the component is connected to another component (3) in electrically conductive manner. The former component is provided on a carrier strip (4) and is partially embedded in a mold housing (5). The latter component is arranged on a pre-mold element (6) in a recess (7) of the carrier strip. An independent claim is also included for a method for manufacturing a module.