Modules, Mounted Components Connect Wireless Equipment

摘要

Electronic component manufacturers have been allocating their resources for development and commercial production of wireless modules for connecting various wireless and electronic equipment., and the components mounted on such wireless modules. The CEATEC Japan 2004, a trade show held in Tokyo on October 5 to 9, highlighted wireless modules developed by component manufacturers. Capable of producing required raw materials such as low-temperature co-fired ceramics (LTCC) on a commercial scale and of mounting their own chip components on boards, these manufacturers exhibited modules designed for wireless LAN and Bluetooth technologies, a module Corresponding to the millimeter wave radio for transmission of high-definition images, newly developed components and other new products.