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High density multi-layer printed circuit board with high reliability of passage holes and processes for the production of this circuit board
High density multi-layer printed circuit board with high reliability of passage holes and processes for the production of this circuit board
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机译:具有高通孔可靠性的高密度多层印刷电路板及其制造方法
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摘要
A high-density multi-layered printed wiring board in which a copper-clad multi-layered board has a hole having a diameter of 25 to 200 mu m and has at least three copper foil layers, wherein at least one hole is made with a laser and all connections between copper foil layers are done with a through-hole perforating through each of the copper foil layers, and a method of producing said multi-layered printed wiring board. IMAGE
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