首页> 外国专利> Micro-technological layer i.e. thin film, transferring method, for use during manufacturing of e.g. optical component, involves carrying out detachment of embrittled zone by application of heat treatment to obtain residues of detached layer

Micro-technological layer i.e. thin film, transferring method, for use during manufacturing of e.g. optical component, involves carrying out detachment of embrittled zone by application of heat treatment to obtain residues of detached layer

机译:微技术层,即薄膜,转移方法,用于制造例如光学元件,包括通过热处理进行脆化区的分离以获得分离层的残留物

摘要

The method involves preparing a substrate (20) comprising a porous layer (11), and forming an embrittled zone (13) between the layer and a free surface. The substrate is adhered on a support substrate (30), and detachment of the layer is carried out by applying mechanical stress to obtain a detached layer made of monocrystalline material. The detached layer is adhered to another support substrate. Detachment of the zone is carried out by applying heat treatment to obtain residues of the detached layer, which are respectively integrated into the support substrates.
机译:该方法包括制备包括多孔层(11)的基底(20),以及在该层和自由表面之间形成脆化区(13)。将衬底粘附在支撑衬底(30)上,并通过施加机械应力进行层的分离以获得由单晶材料制成的分离层。分离的层粘附至另一支撑基板。通过进行热处理来进行区域的分离,以获得分离层的残留物,其分别整合到支撑基板中。

著录项

  • 公开/公告号FR2944914A1

    专利类型

  • 公开/公告日2010-10-29

    原文格式PDF

  • 申请/专利权人 COMMISSARIAT A LENERGIE ATOMIQUE;

    申请/专利号FR20090052621

  • 发明设计人 TAUZIN AURELIE;STRAGIER ANNE SOPHIE;

    申请日2009-04-22

  • 分类号H01L21/301;H01L21/762;H01L21/77;

  • 国家 FR

  • 入库时间 2022-08-21 18:26:32

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