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Micro-technological layer i.e. thin film, transferring method, for use during manufacturing of e.g. optical component, involves carrying out detachment of embrittled zone by application of heat treatment to obtain residues of detached layer
Micro-technological layer i.e. thin film, transferring method, for use during manufacturing of e.g. optical component, involves carrying out detachment of embrittled zone by application of heat treatment to obtain residues of detached layer
The method involves preparing a substrate (20) comprising a porous layer (11), and forming an embrittled zone (13) between the layer and a free surface. The substrate is adhered on a support substrate (30), and detachment of the layer is carried out by applying mechanical stress to obtain a detached layer made of monocrystalline material. The detached layer is adhered to another support substrate. Detachment of the zone is carried out by applying heat treatment to obtain residues of the detached layer, which are respectively integrated into the support substrates.
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