High-volume on-wafer heterogeneous packaging of optical interconnects

• 1. 在晶圆上形成互连通孔失败的补救方法 [P] . 中国专利： CN101958276B . 2012.11.14
• 2. 在晶圆上形成互连通孔失败的补救方法 [P] . 中国专利： CN101958276A . 2011-01-26
• 3. High-volume on-wafer heterogeneous packaging of optical interconnects [P] . 美国专利： US7767486B2 . 2010-08-03

  机译： 大批量晶圆上光学互连的异构封装

• 4. HIGH-VOLUME ON-WAFER HETEROGENEOUS PACKAGING OF OPTICAL INTERCONNECTS [P] . 美国专利： US2009129422A1 . 2009-05-21

  机译： 光学互连的大批量晶圆上异质包装

• 5. High-volume on-wafer heterogeneous packaging of optical interconnects [P] . 英国专利： GB0821211D0 . 2008-12-31

  机译： 大批量晶圆上光学互连的异构封装

• 1. Short-Range Optical Wireless Communications for Indoor and Interconnects Applications [J] . WANG Ke, Ampalavanapillai Nirmalathas, Christina Lim, 中兴通讯技术（英文版） . 2016,第002期
• 2. Compact Packaging of Optical and Electronic Components for On-Board Optical Interconnects [J] . Han Seo Cho, Kun-Mo Chu, Saekyoung Kang, IEEE Transactions on Advanced Packaging . 2005,第1期
• 3. Heterogeneously integrated III-V laser on thin SOI with compact optical vertical interconnect access [J] . Pu Jing, Lim Kim Peng, Ng Doris Keh Ting, Optics Letters . 2015,第7期
• 4. Heterogeneously integrated III-V laser on thin SOI with compact optical vertical interconnect access [J] . Pu Jing, Lim Kim Peng, Ng Doris Keh Ting, Optics Letters . 2015,第7期
• 5. Interaction of redistribution traces with on-wafer interconnects in memory chip packaging [C] . Gospodinova, M., Ktata, . 2005
• 6. Optomechanics and optical packaging for free-space optical interconnects. [D] . Boisset, Guillaume Charles Louis. 1998
• 7. Fan-out routing and optical splitting techniques for compact optical interconnects using single-mode polymer waveguides [O] . Kevin L. Kruse, Christopher T. Middlebrook -1
• 8. Polymer-based optical interconnect technology: a route to low-cost optoelectronic packaging and interconnect [O] . Y.S. Liu 2012
• 9. Three Dimensional Integration and On-Wafer Packaging for Heterogeneous Wafer-Scale Circuit Architectures; Conference paper with briefing charts [R] . Katehi, L., Perlman, B., Chappell, W., 2006

• 1. Review of the Low-Latency Optical Interconnect Technologies for Peta-Scale Computing [J] . S.J.B.Yoo ,Yin Yawei . 中国通信 . 2012,第008期
• 2. Parallel Optical Interconnect Technology: Combination of Higher Performance and Lower Energy Consumption [J] . Qiao Yaojun ,Gu Rentao ,Ji Yuefeng . 中国通信 . 2010,第003期
• 3. Photonics-to-electronics integration for optical interconnects in the early 21^(st) century [J] . Ashok V.Krishnamoorthy . 光电子快报：英文版 . 2006,第3期
• 4. Mineral 4/Recognition 4： A Universal Optical Image Analysis Package for Iron Ore, Sinter and Coke Characterization [J] . Eugene ,Donskoi1 ,Andrei . 能源与动力工程 . 2017,第001期
• 5. 整晶圆IGBT芯片及其全压接平板式封装技术研究 [C] . ZENG Zhong ,曾重 ,LIU Yanlan . 第十一届中国高校电力电子与电力传动学术年会 . 2017
• 6. 玻璃覆晶的封装互连性能检测方法及倒装设备研究 [A] . 盛鑫军 . 2014