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SUBSTRATE OVERLAPPING DEVICE, SUBSTRATE HOLDER, SUBSTRATE OVERLAPPING SYSTEM, METHOD OF OVERLAPPING SUBSTRATE, METHOD OF MANUFACTURING DEVICE, AND APPARATUS AND METHOD FOR JOINING SUBSTRATE
SUBSTRATE OVERLAPPING DEVICE, SUBSTRATE HOLDER, SUBSTRATE OVERLAPPING SYSTEM, METHOD OF OVERLAPPING SUBSTRATE, METHOD OF MANUFACTURING DEVICE, AND APPARATUS AND METHOD FOR JOINING SUBSTRATE
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机译:基板重叠装置,基板保持器,基板重叠系统,基板重叠方法,制造装置,装置及基板接合方法
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摘要
PROBLEM TO BE SOLVED: To align and overlap substrates.;SOLUTION: A substrate overlapping device includes: a temperature control unit for generating a temperature difference between a first substrate and a second substrate; and an overlap unit for alternately aligning and overlapping the first substrate and the second substrate while deformation generated in at least one of the first and second substrates caused by a temperature difference is maintained. In the substrate overlapping device, the temperature control unit may generate a temperature difference between a partial region of the first substrate and the second substrate. Also, the substrate overlapping device includes a calculation unit for making a plurality of alignment indexes provided on the first substrate and a plurality of alignment indexes provided on the second substrate calculate a target position of overlapping where the amount of the positional misalignment of the respective indexes to a reference position is minimized when the first substrate overlaps with the second substrate. The temperature control unit may decide the partial region based on a result calculated by the calculation unit.;COPYRIGHT: (C)2012,JPO&INPIT
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